E-PAC is an innovative foam assembly chassis for electromechanical devices, E-PAC allows your new product to:

• have shorter development cycles
• be assembled faster with less cost
• be lighter, quieter and more rugged
• be easily disassembled, serviced or recycled
• utilise less transit packaging

A new approach to electronic product assembly,
E-PAC replaces conventional metal and plastic chassis structures with parts made from Expanded Polypropylene (EPP) foam.

For E-PAC applications, EPP foam is moulded into relevant geometric shapes that hold components or sub-assemblies in place through their part geometry.

Lightweight and sturdy, E-PAC parts moulded from EPP foam also provide sound attenuation and reduce the mechanical stress on fragile components of highly sensitive electronic equipment. EPP foam is UL approved and can be made antistatic where necessary.